Despite an intensifying technological rivalry between the United States and China, billions of dollars continue to move between the two countries’ artificial-intelligence and semiconductor markets, showing how deeply their financial systems remain connected. According to Reuters, citing LSEG data, Wall Street banks have acted as bookrunners on 19 Chinese high-tech equity deals worth $17.2 billion so far in 2026, representing nearly 30% of the sector’s total issuance, even as Washington maintains restrictions affecting advanced chips, semiconductor technology and certain U.S. investments in sensitive Chinese technology sectors. Meanwhile, capital has also been moving in the opposite direction: U.S. stocks—particularly semiconductor companies—remain major holdings for China’s outbound mutual funds, while the value of U.S. equities held by mainland Chinese and Hong Kong investors has risen about 23% over the past year to more than $750 billion. S&P Global Market Intelligence data cited by Reuters also shows that U.S. AI funding rounds involving investors based in China or Hong Kong reached roughly $8.9 billion through mid-September 2026, compared with about $436 million in 2023. These cross-border flows highlight an unusual feature of the global AI race: while the two countries are building increasingly separate technology supply chains and competing for leadership in chips, models and computing infrastructure, investors continue seeking opportunities on both sides. The financial relationship could nevertheless face greater uncertainty if export controls, investment restrictions or broader U.S.-China tensions intensify, making upcoming bilateral discussions on trade and artificial intelligence particularly important for technology companies and global investors.
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